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Ibhodi lekhompiyutha kanye namaPheripherals PCBA

Ikhompiyutha namaPheripherals PCBA board Isithombe Esifakiwe
  • Ibhodi lekhompiyutha kanye namaPheripherals PCBA

Isevisi yethu:

Izingxenyekazi zekhompuyutha ziyaqhubeka nokukhula mayelana nesivinini, amandla kanye nokugcinwa kolwazi/ukushintshisana.Isidingo se-cloud computing, idatha enkulu, inkundla yezokuxhumana, ezokuzijabulisa nezinhlelo zokusebenza zeselula siyaqhubeka sikhula futhi siqhubekisela phambili isidingo solwazi olwengeziwe ngesikhathi esifushane.


Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Isici semikhiqizo

● -Indaba: Fr-4

● -Isibalo Sesendlalelo: 14 izendlalelo

● -PCB Ukujiya: 1.6mm

● -Min.I-Trace / Space Outer: 4/4mil

● -Min.Imbobo Ebhotshiwe: 0.25mm

● -Ngenqubo: Ukuhlala Ngetende

● -Surface Finish: ENIG

Izici zesakhiwo se-PCB

1. Uyinki ongaguquguquki (i-Solderresistant/SolderMask): Akuzona zonke izindawo zethusi okufanele zidle izingxenye zethini, ngakho-ke indawo engadliwe izophrintwa ngesendlalelo sezinto (imvamisa i-epoxy resin) ehlukanisa indawo yethusi kusukela ekudleni ithini kuya gwema okungeyona i-soldering.Kukhona ukujikeleza okufushane phakathi kwemigqa ethayiwe.Ngokwezinqubo ezahlukene, ihlukaniswe ngamafutha aluhlaza, amafutha abomvu namafutha aluhlaza okwesibhakabhaka.

2. Isendlalelo se-Dielectric (Dielectric): Isetshenziselwa ukugcina ukufakwa phakathi kwemigqa nezingqimba, ezivame ukubizwa ngokuthi i-substrate.

3. Ukwelashwa kwendawo (i-SurtaceFinish): Njengoba indawo yethusi ifakwe i-oxidized kalula endaweni evamile, ayikwazi ukufakwa ithini (i-solderability empofu), ngakho indawo yethusi ezofakwa ithini izovikelwa.Izindlela zokuvikela zifaka i-HASL, i-ENIG, i-Immersion Silver, i-Immersion TIn, kanye ne-organic solder preservative (OSP).Indlela ngayinye inezinzuzo zayo kanye nokubi, ngokuhlanganyela okubizwa ngokuthi ukwelashwa kwendawo.

SFSdvd (1)
SFSdvd (2)

I-PCB Techinecal Capacity

Izendlalelo Ukukhiqizwa okukhulu: 2 ~ 58 izendlalelo / Ukushayela komshayeli: izendlalelo ezingama-64
Ubukhulu.Ubukhulu Ukukhiqizwa okukhulu: 394mil (10mm) / Ukushayela komshayeli: 17.5mm
Okubalulekile I-FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , I-Halogen-Free, i-Ceramic egcwele, i-Teflon, i-Polyimide, i-BT, i-PPO, i-PPE, i-Hybrid, i-Partial hybrid, njll.
Okuncane.Ububanzi/Isikhala Isendlalelo sangaphakathi: 3mil/3mil (HOZ), Isendlalelo sangaphandle: 4mil/4mil(1OZ)
Ubukhulu.Ukuqina Kwethusi Isitifiketi se-UL: 6.0 OZ / Ukugijima komshayeli: 12OZ
Okuncane.Usayizi Wembobo Ukubhola kukamshini: 8mil(0.2mm) I-Laser drill: 3mil(0.075mm)
Ubukhulu.Usayizi Wephaneli 1150mm × 560mm
I-Aspect ratio 18:1
I-Surface Qeda I-HASL,Igolide lokucwiliswa, Ithini lokucwiliswa, i-OSP, i-ENIG + OSP, iSilver yokucwiliswa, i-ENEPIG, Umunwe Wegolide
Inqubo Ekhethekile Imbobo Engcwatshiwe, Imbobo Eyimpumputhe, Ukumelana Okushumekiwe, Umthamo Oshumekiwe, IHybrid, Ingxube Eyingxenye, Ukuminyana okuphezulu ngokwengxenye, Ukubhola Emuva, nokulawula Ukumelana
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    Izigaba zemikhiqizo

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