Umkhiqizi webhodi we-One stop electronic Server PCBA

I-One stop electronic Server PCBA board producer Isithombe Esifakiwe

Isevisi yethu:

Ngokuthuthukiswa kwedatha enkulu, i-cloud computing kanye nokuxhumana kwe-5G, kunethuba elikhulu embonini yeseva/yesitoreji.Amaseva afakwe nekhono lekhompyutha le-CPU elinesivinini esikhulu, ukusebenza okuthembekile kwesikhathi eside, ikhono eliqinile lokuphatha idatha yangaphandle ye-I/O kanye nokwandiswa okungcono.I-Suntak Technology izinikele ekuhlinzekeni amabhodi anesivinini esikhulu namabhodi anezingqimba eziningi ezinokwethenjelwa okuphezulu, ukuzinza okuphezulu kanye nekhono eliphezulu lokubekezelela amaphutha elidingekayo kwikhwalithi yeseva.

Thumela i-imeyili kithi

Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Isici semikhiqizo

● Okubalulekile: Fr-4

● Ukubalwa Kwesendlalelo: 6 izendlalelo

● Ubukhulu be-PCB: 1.2mm

● Okuncane.I-Trace / Space Outer: 0.102mm/0.1mm

● Okuncane.Imbobo Ebhotshiwe: 0.1mm

● Ngenqubo: Ukuhlala Ngetende

● I-Surface Finish: ENIG

Izici zesakhiwo se-PCB

1. Isekhethi nephethini (Iphethini): Isekethe isetshenziswa njengethuluzi lokuqhuba phakathi kwezingxenye.Ekwakhiweni, indawo enkulu yethusi izoklanywa njengesisekelo kanye nesendlalelo sokuhlinzeka ngamandla.Imigqa nemidwebo yenziwa ngesikhathi esisodwa.

2. Imbobo (i-Throughole/via): Imbobo edlulayo ingenza imigqa yamaleveli angaphezu kwamabili ihambisane, imbobo enkulu isetshenziswa njenge-plug-in yengxenye, futhi imbobo engaconductive (nPTH) ivamise ukusetshenziswa. njengendawo yokukhweza nokubeka indawo, esetshenziselwa ukulungisa izikulufu ngesikhathi sokuhlanganisa.

3. Uyinki ongaguquguquki (i-Solderresistant/SolderMask): Akuzona zonke izindawo zethusi okufanele zidle izingxenye zethini, ngakho-ke indawo engadliwe izophrintwa ngongqimba lwezinto (imvamisa i-epoxy resin) ehlukanisa indawo yethusi kusukela ekudleni ithini kuya gwema okungeyona i-soldering.Kukhona ukujikeleza okufushane phakathi kwemigqa ethayiwe.Ngokwezinqubo ezahlukene, ihlukaniswe ngamafutha aluhlaza, amafutha abomvu namafutha aluhlaza okwesibhakabhaka.

4. Ingqimba ye-Dielectric (Dielectric): Isetshenziselwa ukugcina ukufakwa phakathi kwemigqa nezingqimba, ezivame ukubizwa ngokuthi i-substrate.

PCBA technical Capacity

I-SMT	Ukunemba kwesikhundla:20 um
	Usayizi wezingxenye:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP
	Ubukhulu.Ubude bengxenye::25mm
	Ubukhulu.Usayizi we-PCB: 680×500mm
	Okuncane.Usayizi we-PCB: akunqunyelwe
	Ubukhulu be-PCB: 0.3 kuya ku-6mm
	Isisindo se-PCB: 3KG
I-Wave-Solder	Ubukhulu.Ububanzi be-PCB: 450mm
	Okuncane.Ububanzi be-PCB: akunqunyelwe
	Ubude bengxenye: Top 120mm/Bot 15mm
I-Sweat-Solder	Uhlobo lwensimbi :ingxenye, yonke, inlay, sidestep
	Insimbi: Ithusi, i-Aluminium
	I-Surface Finish: i-plating Au, i-plating sliver, i-plating Sn
	Izinga lomoya esinyeni: ngaphansi kuka-20%
Cindezela-lingana	Ibanga lokucindezela:0-50KN
Cindezela-lingana	Ubukhulu.Usayizi we-PCB: 800X600mm
Ukuhlola	I-ICT, i-Probe flying, ukushisa ngaphakathi, ukuhlolwa komsebenzi, ukuhamba ngebhayisikili